On September 4-7, the 21st China International Optoelectronic Exposition was successfully held in Shenzhen Convention and Exhibition Center. Jiangsu Huaxing Laser Technology Co., Ltd. has exhibited high-end epitaxial wafer products such as high-speed laser chips, battery chips and RF chips, and has received high attention from optical communication, optical sensing, laser and other fields.

This exhibition will feature 10G/25G communication high-speed semiconductor laser/detector epitaxial wafer, sensing and high-power semiconductor laser and detector epitaxial wafer (FP/DFB/VCSEL/APD), and customized epitaxial/micro of semiconductor optoelectronic materials.  Processing services.

It is understood that the high-speed semiconductor laser/detector epitaxial wafer is applied to the optical communication broadband network infrastructure construction, providing key optoelectronic chip materials for fiber-to-the-home, data center, mobile base station and other application scenarios, with rates of 10G and 25G.

Sensing and high power semiconductor lasers and detector epitaxial wafers can be used in gas detection, laser ranging, laser radar, laser medical and other fields, including (FP / DFB / VCSEL / APD).

At the same time, customized extension/micro-nano processing services can provide customized extension and micro-nano processing customization services for enterprises, universities and research institutes.

According to Xunshi, Huaxing Laser is positioned as a professional InP and GaAs-based epitaxial wafer finished product and processing service provider. The company mainly manufactures different structures and functions based on GaAs and InP based on metal organic chemical vapor deposition (MOCVD) technology. Semiconductor lasers and probe epitaxial wafers, which are then fabricated into various optoelectronic chips/devices by industrial chain process and packaging companies. They are widely used in industrial fields such as optical fiber communication and laser sensing, and in consumer electronics such as smart phones and AR/VR.

In addition, the company’s electron beam exposure (EBL) technology and holographic exposure technology not only assist in the grating fabrication of optoelectronic epitaxial wafers, but also independently provide micro-nano structure processing services.