Recently, it’s reported that Intel’s next generation artificial intelligence (AI) chip Falcon shoes will adopt TSMC’s 3nm process and CoWoS advanced packaging technology. It has completed tape out and will enter mass production by the end of next year.

The industry pointed out that after Intel acquired Habana, it maintained the latter’s independent operating model and for the first time combined Habana technology with its own GPU technology to enhance AI computing capabilities.

Intel has developed Falcon Shores into a new AI chip platform, which is not only backward compatible with Gaudi3, but will also launch at least three different levels of chips next year, covering high, medium, and low-end markets, to seize AI computing opportunities.

Industry insiders pointed out that Intel’s previous AI server product MAX GPU used five processes including 7nm, and connected bare chips through its own EMIB and Foveros 3D technology. Although it has strong performance, it consumes high energy. This time, adopting TSMC’s solution is expected to solve the problem of high energy consumption and enhance computing performance.

In June, industry insiders revealed that TSMC had secured an order for 3nm chips for Intel’s upcoming laptop (PC) processor series, and wafer production had begun. Intel will shift to a new laptop processor platform in the second half of this year as planned. According to sources, the Lunar Lake and Arrow Lake series will be launched at the end of the third and fourth quarters, respectively.