Molex, a global leader in the electronics industry and innovator in connectivity technology, announced that it has completed the acquisition of Teramount Ltd. Teramount is an Israeli based company that specializes in developing detachable fiber to chip connectivity solutions for mass co packaged optical (CPO) and other silicon optical applications.
This acquisition is based on the solid business cooperation between the two parties. In 2025, Koch Disruptive Technologies led a $50 million Series A funding round for Teramount, with Molex also participating in the related collaboration. Molex announced the acquisition agreement on April 15, 2026, and the transaction has now been successfully completed.
TeraVerse from Teramount ® The platform provides a practical and field maintainable interface between optical fibers and silicon optical chips based on its universal photonic coupler and wafer level self-aligning optical technology. The platform will be unveiled as part of Molex’s one-stop CPO solution at the OFC exhibition in 2026. TeraVRSE is an innovative passive alignment solution that supports high-speed data transmission required for AI applications while consuming less energy, helping to reduce the power and cooling needs of ultra large scale data centers.
Aldo Lopez, President of Molex Data Communication Solutions, stated that “Teramount’s passive, detachable coupling solution supports large assembly tolerances and semiconductor level wafer processes, filling a critical gap in the optical connectivity technology stack. By integrating this unique technology into our optical interconnect product portfolio, Molex provides customers with a smoother path from early prototypes to large-scale CPOs and other silicon optical architectures required in the AI era.”
Hesham Taha, CEO and co-founder of Teramount, stated, “By leveraging Molex’s global scale and system level expertise, combined with Teramount’s innovative capabilities and detachable wafer level coupling technology, we have created a viable path for scalable, high-density CPOs. Joining forces with Molex will enable us to accelerate the delivery of a manufacturable and maintainable fiber to chip interface that meets the urgent needs of AI and ultra large scale data centers.”
Molex stated that Teramount will continue to serve as a design and engineering center for the company in Jerusalem, and will receive support from Molex’s global optical capabilities. It will be integrated into the optical connectivity department under Mole’s X-ray solutions business. Through this acquisition, Molex will combine Teramount’s intellectual property and engineering expertise with its own optical capabilities and global manufacturing scale to provide industry-leading performance metrics and accelerate the production of TeraVERSE.
After adding TeraVERSE to Molex’s comprehensive optical interconnect product portfolio, customers will receive broader support in CPO and silicon optical architecture. As a leader in the field of high-speed communication interconnection, Molex has a unique advantage in providing industry-leading copper and fiber optic cable solutions.
The specific financial terms of the transaction were not disclosed.
About Mole’s X-ray Solution Business
Mole’s X-ray solutions business is a global leader in the design and manufacturing of high-performance optical connections, optoelectronic components, and wavelength management products. With profound expertise in optics and MEMS technology, silicon photonics, precision molding, and automated assembly, Mole’s X-ray solutions business provides support for foundational technologies, powering the world’s most advanced AI clusters and ultra large scale cloud environments.
